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UniqueBud

SKU:090602552A

BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

Regular price Rs. 488.00
Sale price Rs. 488.00 Regular price
Save Rs. -488.00 Sold out
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  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9

  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9