SKU:661600110A
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Imported alloy steel, high-temperature resistant and wear-resistant
Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Compatible with:
iPhone X/8/8 Plus
Package included:
1 x Reballing Stencil
Imported alloy steel, high-temperature resistant and wear-resistant
Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Compatible with:
iPhone X/8/8 Plus
Package included:
1 x Reballing Stencil
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